Micromachining using ultrasonic impact grinding - NASA/ADS
Although largely unknown in the MEMS community, micromachining using ultrasonic impact grinding (UIG) is a fascinating yet easy fabrication scheme to achieve virtually any shape, such as a shallow or deep reservoir, a channel, a via, etc, in silicon, glass and other commonly used ceramic and semiconductor materials in the MEMS field. Because of the patterning and masking issues, etching .